Machine introduction:

FC/L series full-automatic on-line cleaning machine, suitable for high-capacity cleaning equipment for the flux residues of semiconductor devices such as SIP, WLP, FCBGA, etc. before molding. The equipment has been stably used for the cleaning of various semiconductor high-reliability devices such as fingerprint/camera modules, communications, sound waves, radio frequency, power control, etc.

Application areas:

1. Semiconductor manufacturing process

SIP system-in-package, WLP wafer-level packaging, FCCSP flip-chip packaging, PANEL board-level packaging, etc.

IGBT, Mini-LED, LEAD FRAME, COMS, IC carrier board, etc.

2. SMT process

main feature

It is suitable for completing all the processes of chemical cleaning, pure water rinsing and drying in large quantities online;

Excellent cleaning effect, effectively removing flux, organic and inorganic contaminants;

Unique spray system to meet the precise cleaning needs of large size and low clearance;

The overall stainless steel body is more resistant to chemical corrosion and high temperature heating requirements;

Air knife cutting water + ultra-long air knife drying section, fast air cutting and drying;

Multiple option functions to meet wider process requirements and optimize manufacturing costs;

The delivery cycle is short to meet the customized needs of customization;

Localized service team and adequate supply of spare parts;

Provide automation solutions for loading/T material entire line.