Single wafer cleaning equipment has extremely high process environment control ability and particle removal ability, and its market share is relatively small.

Single wafer cleaning equipment generally adopts a rotary spray method. The equipment that uses chemical spray to clean single wafers has lower cleaning efficiency and lower productivity than automatic cleaning stations, but has extremely high process environmental control capabilities and particle removal. ability.

It can be used in a variety of processes, including cleaning before diffusion, cleaning before gate oxidation, cleaning before epitaxy, cleaning before CVD, cleaning before oxidation, photoresist removal, polysilicon removal and other cleaning links and partial etching links.

There is another single-wafer cleaning equipment that uses ultrasonic cleaning, which has a relatively small market share.

There is no big difference between the single-wafer cleaning equipment and the automatic cleaning table in the application process. The main difference between the two is the cleaning method and the accuracy requirements.

To put it simply, the single wafer cleaning equipment is cleaned piece by piece, and the automatic cleaning station is cleaning multiple pieces at the same time. Therefore, the advantage of the automatic cleaning station is that the equipment is mature and the production capacity is high. The back, bevel and edge can be effectively cleaned, while avoiding cross-contamination between wafers.

The scrubber occupies an important position in the cleaning after wafer polishing.

Rotary spray method is adopted, but with mechanical wiping, there are multiple adjustable modes such as high pressure and soft spray, which are used in processes suitable for cleaning with deionized water, including wafer sawing, wafer thinning, wafer polishing, In the process of grinding, CVD, etc., especially in the cleaning after wafer polishing, it occupies an important position.