The tiny dust on the wafer will also affect the function of the integrated circuit. Therefore, before and during the formal manufacturing of the chip, the pollutants to be removed mainly include particles, chemical residues, etc. cleaning the wafer is an important step in the process of manufacturing the chip. Generally speaking, cleaning steps account for 30% of the total process, and cleaning directly affects the yield, There are more and more steps that need cleaning.

Cleaning can be divided into wet method and dry method. Wet cleaning refers to non-destructive cleaning of wafer surface with specific chemical solution and deionized water according to different process requirements, so as to remove particles, natural oxide layer, organic matter, metal pollution, sacrificial layer, polishing residue and other substances in IC manufacturing process. It is the mainstream of advanced manufacturing process that single crystal circle cleaning machine replaces batch cleaning. It can provide better process control, avoid cross contamination and improve yield, but the output rate is low, which can only reach 35% - 60% of trough equipment.