product description:

8-12 Inch single wafer dry-in/dry-out cleaning platform, which is used for particle, organic, inorganic, flux and other pollutants cleaning in advanced packaging processes. Optional two-fluid, megasonic, ultra-high pressure spray, RCA

Hot water and steam cleaning methods, wide cleaning process window, strong cleaning ability, small footprint, and high cost performance.

Function Description:

· Process uniformity can be controlled by recipe.

· Yield rate is better than wet bench type.

· The machine condition of the single-chip mode can be controlled and traced.

· Individual manufacturing process is easy to adjust.

· Controllable amount of chemical solution can be used to maintain the same process environment for each chip.

· Cleanliness control is better than batch production.

· Footprint is small.

· This is used for wafer dry in / dry out process.

· The safety of the machine is better than bench type.

· It is the mainstream machine for the future wet high-end equipment.

Application range:

Advanced packaging process, bumping process, etc., before coating, before photoresist, after etching, after ion implantation, after CMP, flux Clean and other high clean wafer cleaning processes.